Specification
PCB Application | Applicationem processus | Post stencil printing, post / ante calidum aerem refluentem probare potest utrimque et plures simul PCBs |
PCB dimensio | 20×20mm-450×350mm | |
PCB crassitudine | 0.3-5.0mm | |
PCB spatium | top:≤30mm;bottom:≤45mm | |
Visual systematis inspectionis items | Post glamurosas excudendi | Solarium crustulum unavailability, insufficiens vel nimius crustulum solidans, solidamentum misalignment crustulum; |
Ante vel post reflow solidatorium | Absentis vel nimia pars, misalignment, inaequale, limbus defectus, inscensio opposita, verticitatem mali, mali vel mali components | |
Ante vel post MERGO fluctus solidatorium | Superfluum vel absentis componentis, inanis solidatio, globuli solidarii, misalignment solida, defectus limbus, traiectualis, IC NG, macula aeris etc. | |
Imago systematis | CCD camera, German Basler 500 million px | |
Ratio accendendi | Tres canales albi ducti lucis fons seu fons lucis RGB | |
Resolutione | 18um(FOV dimension:28.8 mm×21.6 mm) | |
modus inspectionis | Color calculus, color extractio, res griseo-scala, imago congruens, etc | |
Mechanica ratio | X / Y ratio driving | AC servo motore, Subtilitas stridor pilae cochleae |
PCB determinatio certae partis | Auto fixture | |
Positioning accuracy | 8 um | |
Movere celeritatem | 800mm/s(MAX) | |
Orbitalis commensuratio | Manual | |
Software system | Ratio computandi | EKT780 configuration |
Linguae instrumenti | Seres / Anglis ad libitum | |
inspectionem output | PCB ID, PCB descriptio, component descriptio, defectus descriptio, defectus imaginis | |
Potestas | AC220±10%,50/60HZ,1KW | |
Operatio temperatus | -10-40℃ | |
Operatio humiditas | 20-90% RH non condensans | |
Apparatus dimensionis | 9001100×1300mm |
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