Products
Panasonic SMT Chip Mounter CM602-L
Lata variatio
Modulus aptissimus eligi potest ut elementa ex microchipibus ad partes impares informes collocandas, necnon secundum fructus et ad productionem voluminis pendentes.
* Capita configuratione mutari possunt post emptio.
Configuratione machina
| Configurationis genus | 12 nozzles / 12 nozzles | 12 nozzles / 8 nozzles | 8 nozzles / 8 nozzles | 12 nozzles / 3 nozzles | 8 nozzles / 3 nozzles | 3 nozzles / 3 nozzles | ||
| Caput compositum | A | Typus A-2 | Typus A-1 | Typus A-0 | - | - | - | |
| B | - | - | - | - | - | Typus A-0 | ||
| C | - | - | - | Typus C-1 | Typus C-0 | - | ||
| Ipsumque directum auxilium | Una parte | D | - | Typus D-3 | Typus D-2 | Typus D-1 | Typus D-0 | - |
| E | - | - | - | - | - | Typus E-0 | ||
| utrimque | F | - | - | Typus F-2 | - | Typus F-1 | Typus F-0 | |
Ipsa productivity emendare cum leviore cursu capitis et novo optimizatione
Productivity actualis ( IPC9850 ) 69 500cph ( Typus A-2 )
Levior summus velocitas caput ac novas sequelas fabricandi optimization augebat fructibus by7% comparatis ad exemplar optimiizationis priori Ver.4.
Nova summus flexibilitas 8 nozzles headFurther componentis pertractatio facultatem
Communis Ver.5 (libitum) componentes range exsistentes dilatat.Magna varietas partium, vndique a 0402 chip to50mm et magna mole connectens (100× 50mm), factae sunt.3D sensor et directa lance satietas institui potest ut antequam superiores facultates tractandi partes impares informibus provideat.
Improves area productivity cum pacto pascens plostra
200mm diminutio in magnitudine cart Fseder
· Area productivity crevit XVII%
· Equipment sustentationem est melius
*Feeder Foederis Foederis compatibilitatem habet cum Cart Foederis Conventionis.Utraque genera Feder plostra eodem tempore adhiberi possunt.
Auget collocatione fidem 3D sensorem
·Component bring-retro reprehendo munus
· Crassitudo mensurae munus componentis postquam components mutata sunt
· Nozzle tip munus reprehendo
Crassitudo mensurae munus componentis postquam components mutata sunt
Qualis collocatione ad IC component per 3D sensorem
Summus celeritate deprehensio per batch intuens.
Multum versatile unitas accurate transfert solida / fluxum pro Pop summo packaging / C4 ascendens in gibba latus
Summus celeritas POP collocatione
Tutela per facilem operationem
Crassitudo mutabilis film
Pronus programmabilis gap usura dataChangeable in crassitudine cinematographica inter se componentes
| Max.dimension | |
| 8 nozzles | 20mm |
| 3 nozzles | 38mm |
*High-speed heads (12 nozzles) are not supported.
Copia Unitates
Satietas cart
Typus pascens (8 mm ~ 104 mm)
Baculus nutriens
Automation Unitates
Tape splicing unitatis
Pascens sustentationem unitatis
Specifications
| Brand | CM602-L |
| Model | NM-EJM8A |
| Substratum magnitudine | L 50 mm × W 50 mm L 510 mm × W 460 mm |
| Princeps celeritate adscendens caput | 12pcs COLLUM |
| Adscendens celeritas | 100 000 CPH(0.036 s/chip ) |
| Adscendens accuracy | ± 40 µm/chip(CPK>/=1) |
| Component Size | 0402chip *5 L 12 mm W 12 mm × T 6.5 mm |
| Universalis adscendens caput | LS 8cps COLLUM |
| Adscendens celeritas | 75 000 CPH (0.048 s/chip ) |
| Adscendens accuracy | ±40 µm/chip,±35 µm/QFP>/= 24 mm,±50 μm/QFP<24 cpk="">/=1) |
| Component size | 0402chips *5 L 32 mm × W 32 mm T 8.5 mm *8Generalized VER.5 optio 0402 chip *5?L 100 mm × W 50 mm × T 15 mm * 6 |
| Multi munus collocatione caput | 3pcs COLLUM |
| Adscendens celeritas | 20 000 CPH(0.18 s/QFP) |
| Adscendens accuracy | ±35 µm/QFP(CPK>/=1) |
| Component size | 0603 chip L 100 mm × W 90 mm × T 25 mm *7 |
| Substratum tortor tempus | 0,9 s (optimum condiciones longitudinum subiectarum infra CCXL mm) |
| Potentia copia | Tres-phase AC 200,220,380,400,420,480 V, 4.0 KVA |
| Aeris pressura fons * 1 | 0.49 MPA,170 L /min(ANR) |
| Apparatus dimensiones | W 2 350 mm × D 2 290 mm *2 H 1 430 mm *3 |
| Pondus | 3 400 kg |
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